JPH0711483Y2 - チップ部品の接続固定装置 - Google Patents
チップ部品の接続固定装置Info
- Publication number
- JPH0711483Y2 JPH0711483Y2 JP1989142693U JP14269389U JPH0711483Y2 JP H0711483 Y2 JPH0711483 Y2 JP H0711483Y2 JP 1989142693 U JP1989142693 U JP 1989142693U JP 14269389 U JP14269389 U JP 14269389U JP H0711483 Y2 JPH0711483 Y2 JP H0711483Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- chip
- chip component
- piece
- hook
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005452 bending Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 18
- 238000005476 soldering Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989142693U JPH0711483Y2 (ja) | 1989-12-08 | 1989-12-08 | チップ部品の接続固定装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989142693U JPH0711483Y2 (ja) | 1989-12-08 | 1989-12-08 | チップ部品の接続固定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0381675U JPH0381675U (en]) | 1991-08-21 |
JPH0711483Y2 true JPH0711483Y2 (ja) | 1995-03-15 |
Family
ID=31689510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989142693U Expired - Lifetime JPH0711483Y2 (ja) | 1989-12-08 | 1989-12-08 | チップ部品の接続固定装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0711483Y2 (en]) |
-
1989
- 1989-12-08 JP JP1989142693U patent/JPH0711483Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0381675U (en]) | 1991-08-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |